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IBM High IOPS Modular Adapters 4

Technical specifications

The following table presents the technical specifications for the IBM High IOPS Modular Adapters.

Table 2. IBM High IOPS Modular Adapter technical specifications

Specification 300 GB eMLC 600 GB eMLC 800 GB eMLC 300 GB SLC

Part number 90Y4361 90Y4365 90Y4369 90Y4373

Interface PCIe 2.0 x8

(x8-wired)

PCIe 2.0 x8

(x8-wired)

PCIe 2.0 x8

(x8-wired)

PCIe 2.0 x8

(x8-wired)

Form factor Full height* Full height* Full height* Full height*

Capacity 300 GB 600 GB 800 GB 300 GB

Endurance 11.5 PB TBW 23 PB TBW 30.7 PB TBW 76.8 PB TBW

Sequential read IOPS (4 KB) 172,000 172,000 218,000 179,000

Sequential write IOPS (4 KB) 79,000 79,000 75,000 100,000

Sequential read rate (256 KB) 1.5 GBps 1.5 GBps 2.0 GBps 1.5 GBps

Sequential write rate (256 KB) 500 MBps 500 MBps 1.0 GBps 850 MBps

Access latency 50 μs 50 μs 50 μs 50 μs

Power requirements 25 W 25 W 25 W 25 W

* Low profile bracket is also included with the adapter.

The TBW value assigned to a solid-state device is the total bytes of written data (based on the number of

P/E cycles) that a device can be guaranteed to complete (the percentage of remaining P/E cycles is equal

to the percentage of remaining TBW). The IBM warranty for the solid-state storage is limited to devices

that have not reached the maximum guaranteed number of program/erase cycles. Solid-state storage that

reaches this limit might fail to operate according to its specifications. Because of such behavior by these

devices, careful planning must be done to use solid-state storage in the application environments to

ensure that the TBW of the device is not exceeded before the end of the required life expectancy.

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IBM 90Y4361 Scheda Tecnica Pagina 4